IRP Presentation

Report
Mixed-Signal Option for the
Teradyne Integra J750 Test System
May08-12
Emily Evers
Vincent Tai
Problem Statement
The Teradyne system has been updated to
allow for analog circuits to be tested, but
there are no working test files for ADC, DAC
and Op-Amps.
Concept Sketch and System Block
Diagram
Hardware
IG-XL
Software
Documentation
Devices
Hardware
Software
System Description

Devices





Analog-to-Digital (ADC)
Digital-to-Analog (DAC)
Op-Amp
IG-XL Software

Hardware


Device Interface Board
(DIB)
 Connects daughter
board to tester via pogo
pins
Daughter Board
 Connects device to DIB


Test Plan
 Pin and Channel Map
 AC and DC Specs
 Timing
Pattern
Documentation


Updated Cookbook
Commented IG-XL files
4
User Interface and Operating
Environment

User Interface



IG-XL Software
Cookbook
DIB

Operating Environment



The room environment
needs to be kept at a
consistent temperature of
25°C ± 3°
Electrostatic discharge
wrist bands must be
worn when using the
tester
Access code
Requirements

Functional


Cookbook be written for
the new users
Testing procedures
covers the devices:
 Analog-to-Digital (ADC)
 Digital-to-Analog (DAC)
 Op-Amp

Nonfunctional




Documentation in
English
Test program for devices
and similar ones
Cookbook for specified
devices
Easy to trouble shooting
Market Survey



Teradyne website
Previous team’s website
Teradyne lab manuals
Work Breakdown Structure

Review Status




Previous work
Teradyne Training Material


IC Interface


Test Plan Development

Daughter Board
DIB



Documentation



Create IG-XL code for
testing devices
Debug previous code
Add current limits
New test plans
Execute testing
Create Mixed-Signal Option
Cookbook
Create maps for daughter
board, DIB and socket
converters
Reporting
Project Schedule
Resource Requirements

Resource Team



Faculty Advisor: Dr. Weber
Faculty Advisor: Dr. Smith
Team effort
Review
Status
IC Interface
DAC
ADC
Op-Amp
Documentation
Reporting
Total hours
Emily Evers
30.75
17
7
29
5
15
31.5
135.25
Vincent Tai
22
18.5
10
20
15
10
15
110.5
Total
52.75
35.5
17
49
20
25
46.5
245.75
10
Resource Requirements

Financial requirements
Item
Cost
Materials
Poster
$35.00
Devices
$130.00
Daughterboard
$200.00
Subtotal
$365.00
Emily Evers
$1352.5
Vincent Tai
$1105
Subtotal
$3562.5
Labor($10.00/hr)
Total
$3927.5
11
Risks

Risk:



Problems learning program
Limited team members
Risk Management:


Read Teradyne manuals and previous groups
documentation
Time management
Design Method
Inputs
Process
Outputs
Parts
Results
Cookbook
ADC
DAC
Input/Output Signals
Op-Amp
Calculations
AD7892
AD7470
AD5440
AD5447
AD823
Hardware
Software
IG-XL Program
ADC & DAC
Op-Amp
INL & DNL
Bandwidth
Offset Voltages
Intermodulation Tests
Interfaces
J750 Tester
DIB
Daughterboard
Socket converter
Computer
Input and Output Specification

Input



DAC
 LTC1450
Op-Amp
 AD823
ADC
 AD7470

Output



Input signals
Output signals
Calculations
 ADC


DAC


INL and DNL
INL and DNL
Op-Amp



Offset Voltage
Bandwidth
Intermodulation
Distortion
Hardware, Software, and User
Interface Specification

Hardware




Daughterboard
DIB
Socket converter
User Interface


Updated Cookbook
IG-XL test files

Software


Pattern Tool
IG-XL
 Pin and Channel Maps
 AC, DC, and Global
Specs
 Time sets and Pin
Levels
 Test Procedures
Test Specification

Component Test


Test individual IG-XL source and capture
System Test

Test IG-XL test file and pattern
Detailed Design

DAC Schematic
17
Detailed Design

Op-Amp Schematic
18
Detailed Design

ADC Schematic
19
Build – Pin Map

Define pins on IG-XL
20
Build – Channel Map


Define connections from daughterboard to tester
DAC
21
Build – Channel Map

Op-Amp
22
Build – Channel Map

ADC
23
Build – Board Wiring
24
Build – AC Specs

Specify AC variables
25
Build – DC Specs

Specify DC variables
26
Build – Pin Levels

User specify voltage level for high/low logic level.
27
Build – Time Sets


Create timing basis for pattern
Allow for testing on digital pins
28
Build – Test Procedures

Set up user defined tests
29
Build – Test Instances


Set up IG-XL template tests
Input data for user defined tests
30
Build – Pattern



Uses time sets from IG-XL file
User defined inputs
Can be used to start analog and digital source and capture
signals
31
Build – Pattern

Several sheets are
used in the pattern file



Pin Lists
Imports (time sets)
Instruments
32
Test

System testing was done using an oscilloscope
33
Test
Test

Teradyne System Testing


Functional Test
Continuity Test
35
Test

Functional and Continuity Outputs
36
Earned Value Analysis







Budgeted Cost of Work Scheduled: $4365
Actual Cost of Work Performed:
$3650
Budgeted Cost of Work Performed: $3895
Cost Variance:
$3530
Schedule Variance:
-$470
Cost Performance Index:
1.067
Schedule Performance Index: 89.23%
37
Lessons Learned



Team Work
The value of hands-on experience
Verify Input Signals:
Use oscilloscope and multimeter.
38
Conclusions

Accomplishments



Updated CprE 210 D-flip flop test
Created an interface mapping of the current
boards
ADC



Wired daughter board
Created IG-XL test file
Ran tests
Conclusion

Accomplishments



DAC
 Wired daughterboard
 Created IG-XL test file
Op-Amp
 Wired daughterboard
 Created IG-XL test file
Updated Cookbook
40
Conclusions

Future Work

Run tests on DAC and Op-amp


Fix if needed
Finish ADC test file

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