Ghassan Malek

Report
Integrated Systems Nanofabrication Cleanroom
Optical Lithography
Ghassan Malek
Sr. Development Engineer
October 6, 2010
OUTLINE
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Optical Lithography Main Tools
Lithography Support Equipment
Future Tools and Projects
Acknowledgements
October 6, 2010
SUSS CONTACT ALIGNER
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Model MA6
TSA/BSA Alignment
Pieces to Full 6” Wafers
1 um Resolution with
Vacuum Contact
• Wafer Direct Bonding
October 6, 2010
SF100 XPRESS
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•
•
•
Maskless Lithography
Uses a Range of Wavelengths
Smart Filter Technology
Process Wafers and
Non-Wafer Substrates
• Process Non-Flat Subs
• File in BMP
October 6, 2010
SF100 EXPRESS
October 6, 2010
SF100 EXPRESS
Photoresist Patterns on Round Substrates
October 6, 2010
ASML STEPPER
Model PAS 5500 /200 5X I-Line
SHORT STORY
October 6, 2010
SOME DIFFICULTIES
October 6, 2010
SOME DIFFICULTIES
October 6, 2010
ASML STEPPER
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Model PAS 5500 /200 5X I-Line
2 Point Global Alignment
Resolution < 350nm
Single Machine Overlay < 50nm
Field Size X Y Max 22.0mm x 27.4mm
Pieces to Full 8” Wafers
Variable NA 0.48-0.60
ArialTM Illuminator
October 6, 2010
ILLUMINATION PATH
October 6, 2010
SIZE MATTERS
October 6, 2010
ASML STEPPER RETICLE
• Reticle Size 6” x 6”
• Quartz 0.250” for
Sub-0.5um
• Pellicle
• GDSII File
• Design can be checked
before generating
reticle
October 6, 2010
ALIGNMENT MARK
October 6, 2010
ANATOMY OF THE ASML JOB
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•
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Cells
Die and Exposure Fields
Images and Image IDs
Layer Numbers and Layer IDs
Layer ID, Image ID and Reticle ID
Image Location and Masking Window
Alignment Marks
October 6, 2010
RETICLE ORDER FORM
Mask Order Form
Ship to:
Bill to:
Today's Date:
PO#:
Compugraphics USA
120 Albright Way
Los Gatos, CA. 95032
Req.Ship Date:
Phone (408) 341-1600 Fax: (408) 866-2248
No. of Layers:
email to: [email protected]
Customer:
Material:
Plate Size:
Thickness:
Data Format:
Data Units:
Attention:
Contact:
Applicable Spec:
Substrate:
Data:
Data Placed:
Attention:
3" x 5"
4"
5"
6"
.090"
.120"
.150"
.250"
Quartz
Sodalime
7"
7.25"R
9" X .120"
1X
4X
UT1X
For UT1X Steppers Only:
Arrayed (include layout)
DWG
Other
DXF
cm
Title Parity:
Chrome UP
Filename:
Structure:
Delivery
Qty
Order
Mask Title
(layer specific)
GDS
Layer
Fax:
Product Type:
Stepper:
1 pattern centered
MEBES
GDS
microns
mm
Mils
inches
Device:
Phone:
Email:
Right
Wrong
Scale Data:
X
Orient Data:
Digitized Data
Clear or Dark
CCW
Address Drawn CD
Size
5X
10X
Wide Field
Other
Submaster
Standard Field
Prints to be made?
No
Yes
Print Material Type:
Alignment Marks Req?
Qtz / Iron Oxide
Barcode Required?
Barcode Format:
Title Format:
Fracture Window:
Qtz / AR
Sodalime / IO
Sodalime / AR
X
Y
When prints are
required, define parity of
submaster rather than
final print
CD Tone
Clear or Dark
Parity/ Chrome UP
Right
Wrong
lower left corner:
upper right corner:
Bias
Final CD
CD Tolerance
+ or Size
+/-
1
2
3
4
5
6
7
8
9
10
Requirements:
Defect Criteria
Defect Size
Defect Density (psi)
OR
# Defects per plate allowed?
Inspection Method Required:
Manual
Die to Die
Critical Dimensions
# of Readings
CD's Reported as:
Mean
Absolute
Jpegs Required
Die to Data
Remote View Reqd.
Documentation
Inspection
Maps
LMS Maps
Certificate of
Conformance
CD labels
Pellicles
Registration: (LMS 2020)
None
LMS Req'd?
Single Sided
Guaranteed to:
Double Sided
Tolerance: +/-
Pellicle Type or Part #
To Grid
No
Yes
Shipping Instruct.
Hand Carry
FedEX
UPS
Account #
Or Match?
Special Instructions:
Form: MOF 12/8/09
October 6, 2010
ASML JOB ORDER FORM
ISNC ASML Job Order Request Form
Rev 01, 09/22/10
Date Received:
Page 1 of 2
For ISNC Use Only:
Rev 01, 09/22/10
Primary Marks (PM)
Location (Layer)
ISNC ASML Job Order Request Form
Mark Name
Page 2 of 2
Calculate X and Y Coordinates from Reticle Center (0, 0)
X Coordinate
Y Coordinate
Requester:
Professor/Company:
Device Name:
Primary Flood Opening (PF)
Location (Layer)
Device Size:
X=
um
Y=
um
Device Field Array:
Cols =
Device Field Size:
X=
mm
Y=
mm
X=
mm
Test Patterns
Name
Rows =
Specfic Instructions
Device Field Shift:
Y=
mm
Rotation (Circle One):
0
o
45
Test Patterns (Circle One):
YES
NO
Zero Layer Process (Circle One):
YES
NO
Zero/First Mask Combined (Circle One):
YES
NO
Reticle Information
Layer Name
October 6, 2010
Reticle ID
o
180
o
If Yes, How Many?
CDs (um)
Reticle Transmission%
Calculate X and Y Coordinates from Reticle Center (0, 0)
X Coordinate
Y Coordinate
TP Size X (um)
Calculate X and Y Coordinates from Reticle Center (0, 0)
TP Size Y (um)
X Coordinate
Y Coordinate
INITIAL RESULTS
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Test Mask
Megaposit SPR 660
Developer MF-26A
Resist Thickness 750nm
Exposure 130mJ at -0.1um Focus
October 6, 2010
INITIAL RESULTS
October 6, 2010
SVG 8800 WAFER TRACK
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Two Track System
One Active Coat Track
Send-HMDS-CP-Coat-SoftBake-Receive
Configured for 4” or 6” Wafers
Two Active Resist Pumps
Capable of 3 Resists
October 6, 2010
SVG 8800 WAFER TRACK
October 6, 2010
SVG 8800 WAFER TRACK
• IDI M450 Photoresist
Pumps
• ChemNetTM Software
• Dispense Volume Range
0.1ml to 50ml
• Viscosity Range 1.0cP to
100cP
October 6, 2010
SVG 8800 WAFER TRACK
Coat Program
Program #
Event
Operation
Arm Time
Speed
Accel
1
1
SPIN
0
0
10
Target: 10um
2
DISP1
6
0
10
3
SPIN
0
3.0
2.00
10
4
SPIN
0
28.0
3.00
50
5
EBR
1
25.0
1.00
50
2
25.0
1.00
50
0
15.0
2.00
50
6
7
SPIN
8
END
9
October 6, 2010
0
Exhaust
Material
s Used
PI 2771
LITHO SUPPORT EQUIPMENT
• Headway Spin Coaters
• Headway Stand Alone
Coater
• Hot Plates
• Acid and Solvent Fume
Hoods
• Carbolite High
Temperature Oven
October 6, 2010
• Vacuum Oven
• Nanospec Film
Thickness
Measurement
• AST Contact Angle
Measurement
• Leica and Nikon
Microscopes
HEADWAY SPIN COATERS
October 6, 2010
WAFER SURFACE ANALYSIS
• AST VAC-3000S
• Contact Angle
Measurement
October 6, 2010
CARBOLITE HIGH TEMP OVEN
• Up to 600°C
• Programmable
• Eurotherm Controller
October 6, 2010
MICROSCOPES
• Leica and Nikon Microscopes
• Leica Application Software
October 6, 2010
FUTURE PROJECTS
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Add Developer Track
Add Third Resist Pump
Add Spin Coater for Thick Resist
Applied Material 7830SI CDSEM
Several Fume Hoods
October 6, 2010
ACKNOWLEGEMENTS
• Micron Technology & ASML
• Janine Rush-Byers
• Micron University Relation Manager
• Troy Sych
• ASML VP Strategic Account Management
• Michael Brennan
• ASML Regional Customer Support
October 6, 2010
ACKNOWLEGEMENTS
• International Rectifier Corporation
• Oleg Khaykin
• President and CEO
• Nick Brand
• GM & VP, El Segundo & WW Wafer Fab Strategies
• Larry Jones
• Site Facilities Manager
October 6, 2010

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