Electronic System Partitioning

Report
Universita’ di Pavia
24 Marzo, 2004
Microelettronica e MEMS Oggi
Bruno Murari
STMicroelectronics
Outline

The Electronic System Building Blocks

System Oriented and Smart Power Technologies

MEMS: Inertial Sensors and Microactuators

Microfluidics: Lab on Chip and Photonics
Switches

Packaging and Interconnections

Conclusions
The Electronic System
Building Blocks
Line, Batteries,
Alternators, Solar Cells, Fuel Cells
G
LO D
A L
N R
A WO
A
N
W AL
O O
R G
LD
Concentrated System in a Single Box
Power Management
Bipolar, BCD, CMOS
BiCMOS, VIP, µ-Machining
Sensors
Lamps
Motors
Antennas
Data Acquisition
and Conversion
Keyboards
Central Processing
(µP, DSP)
Clock
Bipolar, CMOS,
RF-BiCMOS,
µ-Machining
Line
Interfaces
Clock
Digital CMOS
Displays
Power
Actuators
Bipolar, BCD,
CMOS, HVCMOS,
VIP, µ-Machining
Clock
G
LO D
A L
N R
A WO
CMOS, Flash,
DRAM, µ-Machining
Speakers
Multifunction
Peripheral (System
Oriented Tech.)
Antennas
A
N
W AL
O O
R G
LD
Memories
CRTs
Inkjets
Switches
Information
Processing
(Super Integration)
Solenoids
Typical Aggregation of Different
Technologies for System Optimization
System Oriented and Smart
Power Technologies
BCD History
and Evolution
Engine Control Unit Architecture
Typical SoC for Intelligent
Mirror in Modern Cars
Example of Intelligent
Mirror in Modern Cars
Typical Power Management Chip
for Mobile Phones
Example of Portable Sets
that require Sophisticated
Power Management Chips
Optical Data Storage Disk Drive
N/P-LDMOS in H-bridge
• Integrated motor driver
device with capability to
control the spindle,
tracking,
focus and tray motors.
• This device operates on a
single 3.3V supply and
provides integrated
power FETs for all
engine motors.
N/P-LDMOS
in H-bridge
Power Combo for Data
Storage Hard Disk Drive
N/P-LDMOS in H-bridge
Logic CMOS
Logic CMOS
N/P-LDMOS
N/P-LDMOS
Head Driver for Printer
Efficiencies for Different Classes of
Operation for Audio Output Amplifiers
System Structure of High Efficiency PA
Final Amplifier Front
Final Amplifier Rear
FP
+
RM
I_F
-
I_R
Rear
Front
Vin F
-
FM
Vin R
RP
High
Impedance
I_RP
Control Logic
Buffer
+
Example of 2x75 Watt
High Efficiency PA
Thick (6 mm) Copper Metallization
DDX ® - Direct Digital Amplification
MEMS: Inertial Sensors
and Microactuators
Silicon as Structural Material
MEMS
MEMS:
Micro Electro Mechanical System

–
three dimensional device
embedded in silicon
– multifunction system consisting
of sensors, actuators,
electronics.
Different Type
of Accelerometer
Rotational Accelerometer
Silicon Microstructures in Future HDD
Typical Assembly of an HDD
Suspension with Microactuator
Microactuator Chip
Microactuator Concept
Microactuator without Cap Movie
Microactuator with Cap Movie
Atomic Resolution Storage from HP
Atomic Resolution Storage
(ARS) technology

Uses focused electron beams and a
phase change media to read and
write data

Micromachined movers provide high
resolution access of media by fixed
emitter tips

Technology developed at HP Labs
ARS products

Perfect for mobile applications

Small, high density storage

Memory cards and embedded
storage applications

Cost effective … enabling appliances
and applications
Scientific American – January 2003
Millepede from IBM
High Doped
Silicon Cantilever
Heater
Scientific American – January 2003
Millipede Movie (from IBM web Site)
Microfluidics: Lab on Chip
and Photonics Switches
Ink Jet Cartridge
Lab on Chip
“Sample to Answer” Flow
Lab on Chip Movie
Bubble Switch for Optical Network
ST/AGILENT Partnership
Photonic Switching Concept
ST/AGILENT Bubble Switch Movie
Packaging and
Interconnections
High Voltage Interconnection
High Voltage
Through Silicon Vias
Multichip and Stacked Dice
Conclusions

The VLSI evolution has been and will a be major
driving force, but does not cover the whole
picture

Interfacing the real world requires for different
approaches, skills and education

Analog electronics is the bridge between the
laws of nature (physics) and computing
(software):
multidisciplinary
by
nature,
impossible to be constrained in one scheme

Lateral thinking is a key process for quantum
leaps in innovation
Thank You

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