Proprietary and Confidential Direct Plating Neopact Seleo CP Plus

Report
Direct Plating
Neopact
Seleo CP Plus
Proprietary and Confidential
Direct Plating
Application Guide
Segment
Application /
Build-up Technology
Direct Plating
Technology
Recommended
Process
Organo/Pd
Colloid
Neopact
Conductive
Polymer
Seleo CP Plus
Conductive
Polymer
Seleo CP Plus
Advanced Materials
HDI, MLB
(PTFE, BT, High Tg FR4, PI,
Ceramic…)
Standard & Advanced
Materials
(High Tg FR4, halogen free, …)
Standard Materials
MLB, DS
(Low – mid Tg FR4)
Proprietary and Confidential
Neopact
Main Industry Requirements
Reliability
 TCT 500 – 1000 cycles
 Thermal shock 3 – 9 x 288°C
Functionality
 Control systems e.g. engine, braking, climate
 Communication / navigation
 Entertainment systems
Automotive
Cost
 Costs of raw materials
 OEM demands for lower cost
Environment
 RoHS / EU regulations
 Recycling regulations
 Waste water restrictions
Proprietary and Confidential
Industry
Neopact
Background
Market release more than 18 years ago
Direct metallization process for flex material and MLB production such as back
panels for end- market like automotive and industry
High Pd adsorption of conductor on all types of laminates for good conductivity
Conductor Neopact
400ppm Pd
Pd activator type A
Pd activator type B
90ppm Pd
Magnification 315000x
Proprietary and Confidential
250ppm Pd
Neopact
Features & Benefits
Tin- free Pd colloidal activation system
Highly versatile, reliable application for different technologies
Suitable for ALL base materials (PTFE / Flex)
Applicable as vertical and horizontal process
Good adhesion of acid copper on surfaces with low roughness
All customer requirements fulfilled
MIL P-55110
MIL P-55110 D
MIL P-50884
SN 57030
IPC-TM-650
IPC-A-600F
Perfag 3 B
Bosch K8 (Automotive)
Proprietary and Confidential
Neopact
Process Sequence – Vertical Process
Temp
(°C)
Time
(min)
Process Baths
35
2
Etch Cleaner based on SPS or
Etch Cleaner Securiganth C
50
5
Conditioner Neopact UX
30
2
Selector Neopact AB or
Securiganth Etch Cleaner
20
1
Pre Dip Neopact
Conductor
50
5
Conductor Neopact
Post Dip
25
1.5
Post Dip Neopact
Etch Cleaner
Conditioner
Selector
Pre Dip
Acid Cu Plating
Proprietary and Confidential
Neopact
Typical Results – Base Materials
PIC 170
Isola DE117
Tg = 170ºC
DuPont
Pyralux AP
Rogers R4350
Tg > 280ºC
Proprietary and Confidential
Neopact
Typical Results – BMV
FR4
Ø 4mil
depth 65µm
RCC
Ø 4mil
depth 65µm
Proprietary and Confidential
Neopact
References
Horizontal
Vertical
Total
16
28
44
2.000.000 m²
300.000 m²
2.300.000 m²
Europe
11
26
37
Japan
2
1
3
China
2
0
2
Taiwan
1
0
1
RoW
0
0
0
No. of lines
Total capacity
Status 03/2010
Neopact is a well established production proven
process for several applications and end-user markets
Proprietary and Confidential
Seleo CP Plus
Proprietary and Confidential
What is Seleo CP Plus?
Direct Plating process (alternative to electroless copper) for
MLB and HDI manufacturing
Based on a conductive polymer as conductive layer
Very GREEN and short process with only 4 active process steps
Seleo CP Plus –
The Plus for your green conscience
Proprietary and Confidential
Why use Seleo CP Plus?
Features and Benefits
Environmentally friendly
 Very short & simple process
 Low chemistry usage per m² cut board
 Low generation of waste water
 Low consumption of fresh water
 No usage of harmful chemicals as e.g. formaldehyde, cyanide
CN– HCHO
Economical advantages
 No dependence on Pd price
 Low space requirement
 Reduced investment costs
 Low running costs (chemistry / fresh water / waste water)
Technical benefits
 Selective process with excellent reliability
 BMV & direct pattern plating capable
 Horizontal & vertical application possible
 Robust conductive layer – 2 time holding time possible
 Copper particle free production
Atotech’s Solutions MLB Production using Advanced Basematerials
Saint Petersburg, May 2013, JPO
Proprietary and Confidential
Pd
Seleo CP Plus
Process Description
Etch
Cleaner
Conditioner
Adhesion
Promoter
Polyconduct
S
Metallization
(E’lytic Cu)
MnO
MnO22 + 2
+
4H+

S
Proprietary and Confidential
S
+ Mn2+ + 2 H2O
Seleo CP Plus
A Truly Selective Process
Etching
gap
In the conductive layer
Seleo CP Plus reduces the risk of a gap developing in the conductive layer near
to inner layers which can occur if non selective direct plating processes are
used which require etching to clean innerlayers (e.g. carbon/graphite and some
conductive palladium processes)
Proprietary and Confidential
Horizontal Process Comparison
Footprint
E’less Copper
Cleaner
2
Etch Cleaner
Pre Dip
4
Activator
3x
18.1 m
3
3x
3x
5
6
Reducer
E’less
Copper
1
Etch Cleaner
(optional)
2
Conditioner
3
Adhesion
Promoter
4
Polyconduct
3x
3x
10.8 m
1
Seleo CP Plus
1x + 3x
3x
Reduced line length
3x
2 less active modules
1x + 2x
1 less cascade rinse
Calculation Basis:
Uniplate Seleo CP (UTS-s, 1.5m/min), Triple Rinses
Proprietary and Confidential
Environmental Benefits
Total Chemistry & Water Consumption
Uniplate (UTS-s, 1.5m/min), Triple Rinses
+ 27%
E'less Cu
14000
Seleo CP Plus
12208
12000
8000
- 69%
6000
- 100%
- 31%
4700
4487
- 82%
- 97%
- 93%
- 90%
- 100% - 100%
4000
1380
2000
0
140
228 158
25
38
21 1
31
4
25
2
4
0
Ag
en
t
Re
d
ne
nt
po
Co
m
et
al
M
Proprietary and Confidential
uc
in
g
/S
al
t
as
e
B
pl
ex
an
t
Co
m
c
O
rg
an
i
or
ga
ni
c
In
In
or
ga
ni
c
A
ci
d
an
t
O
xi
d
ft
w
at
er
So
r
DI
w
at
e
w
at
er
0
Ci
ty
g/m² c.b.
60% less chemistry consumed
28% less fresh water consumed (5.2kg/m²)
9618
10000
0
Environmental Benefits
Total Wastewater Generated Rinses & Active Modules
Uniplate (UTS-s, 1.5m/min), Triple Rinses
12000
Seleo CP Plus
9940
10000
g/m² c.b.
8000
E'less Cu
+ 34%
7408
- 69%
29% less generated wastewater
(5.5kg/m²)
7820
6000
- 12%
4000
- 97%
- 100%
- 75%
2414
1464 1293
2000
1362
908
46
0
327
83
0
Rinse Water
Acidic/Alkaline
Rinse Water
Complex
Conc. Oxidizing
Conc. Complex
Proprietary and Confidential
Conc. Alcaline
Conc. Acidic
Reliability – SST
Solder Shock Test & ICD Performance
Hole diameter 1.0mm
6x @ 288°C (acc. IPC-TM-650 #2.6.7.1)
Hole diameter 1.0mm
9x @ 288°C (ISOLA E-Cu 114)
Solder shock test, up to 9x at 288ºC, passed !
Proprietary and Confidential
Reliability – TCT
Temperature Cycle Test 1000 cycles & ICD Performance
Ø1.0mm ML 2.4mm (ISOLA IS 400)
1000 cycles TCT and soldering
Ø1.0mm ML 1.7mm (Panasonic R1566)
1000 cycles TCT and soldering
Temperature cycle test, up to 1000cycles and soldering, passed !
Proprietary and Confidential
Reliability – IST
Interconnect Stress Test & ICD Performance
Post interconnect
(power circuit)
Hole diameter 1.0mm
2000 cycles IST (Shengyi S1000)
Interconnect stress test, up to 2000 cycles, passed !
Proprietary and Confidential
Reliability
Seleo CP Plus Summary
Specifications
solder float
Solder Shock
Test
(SST)
solder dip
Temperature
Cycle Test
(TCT)
-40°C (10’) +125°C (10’)
-40°C (15’) +125°C (15’)
Interconnect
Stress Test
(IST)
800 cycles
Base Material
9x288°C, 10s
ISOLA E-CU 114, IS 405
6x288°C, 10s
ISOLA E-CU 114, IS 405
6x228°C, 10s
PI- Flex
3x288°C, 10s
HITACHI CHEMICAL MCL-BE-67G(H)
8x288°C, 10s
SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33,
22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya AntiCAF R1766G // PANASONIC R1566W
6x288°C, 10s
TUC TU662 // ISOLA IS 402 , IS 420
5x288°C, 10s
HITACHI CHEMICAL MCL-BE-67G(H) // PANASONIC R1566W //
ISOLA FR-370 Turbo, NELCO N4000-13 , N4000-6
200 cycles and 3x
reflow as pre-cond.
ISOLA IS402
500 cycles
ISOLA IS402, IS405
1000 cycles and
soldering 1x288°C, 10s
ISOLA IS400 // PANASONIC R1566W
500 cycles
SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33,
22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya AntiCAF R1766G // PANASONIC R1566W
3x reflow as pre-cond.
ISOLA IS402
1000 cycles
-
ISOLA IS402
2000 cycles
-
SHENGY SYL-S1000
Proprietary and Confidential
Customer Experiences
Horizontal / Panel Plating
16 layers 3.2mm / 0.65mm AR 1:5
6 layers 1.6mm / 0.9mm AR 1:1.8
2.0mm / 0.11mm AR 1:18
8 layers 1.6mm / 0.2mm AR 1:8
4 layers 1.6mm / 1.1mm
AR 1:1.5
Seleo CP Plus and smooth
leveling down the hole
Proprietary and Confidential
Customer Experiences
Horizontal / Full Pattern Plating
6 layers 1.6mm / 0.35mm AR
1:4.6
6 layers 1.6mm/0.7mm AR 1:2.3
10 layers 1.6mm / 0.3mm AR 1:5.3
detail
4 layers 1.6mm / 0.3mm
AR 1:5.3
Compatible with Direct Imaging
Atotech’s Solutions MLB Production using Advanced Basematerials
Saint Petersburg, May 2013, JPO
Proprietary and Confidential
Customer Experiences
Horizontal / Mechanical Drilled BV
90µm / 100µm
1.0mm / 1.2mm
400µm / 500µm
µ
90µm / 100µm
300µm / 300µm
250µm / 250µm
Panel & Pattern Plating
Proprietary and Confidential
Customer Experiences
Horizontal / Laser Drilled BMV
100 / 75 µm
Large Window
100 / 75 µm
100 / 75 µm
µm
1.0 / 1.2mm
Inpulse 2HF
/ /75µm
2 A/dm
, 100
10
² minutes
m
µ, Copper
4
100
75µm
100 / 75µm
Proprietary and Confidential
100 / 75µm
Customer Experiences
Horizontal Qualification Results
4 layer
10 layer
6 layer
12 layer
8 layer
1 week, 3 shifts
13380 panels ~1915 p./day
4335 m² ~620 m²/day
Thickness:
1.0  2.4 mm
Drill dia:
0.25  ~4.0 mm
Aspect ratio: 1:10
MLB:
2  12 layer
Basematerial: Tg 130  Tg 170
Proprietary and Confidential
Customer Experiences
Base Material Compatibility
Supplier
Arlon
DuPont
EMC
Hitachi Chemical
Isola
ITEQ
Matsushita
Mica
Nelco
Material
FR 25N
DiClad 522/725
Pyralux AP8525
Pyralux AP8525R
EM 320(5)
MCL-BE-67G(H)
GIA 671N
DE 104
IS 402
IS 400
DE 114
DE 156
IS 410
IS 420
FR-370 TURBO
G 200
IS 620i
IS 640
P 96
IS 415
IT 140
IT 158
IT 180
IT 200 DB S
1650 C
MC 100 EX
Anticaf- R 1766 G
R 1566
R 1566 W
HR 02
H 01
22
22 B5
HR 33
N 4000-6
N 4000-13
N 7000
RO 3000
Tg [°C]
Lead free
processible
Halogen
free
RoHS
compliance
yes
yes
yes
yes
yes
no
yes
no
no
no
no
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
no
no
yes
yes
yes
yes
yes
yes
yes
yes
Yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
not available
not available
not available
Yes
yes
yes
yes
190
300
220
220
150
150
220
135
140
145
150
155
180
170
175
185
220
220
260
200/220
140
160
180
200
135
137
140
148
153
170
> 170
not available
not available
not available
175
210
250
300
not available
not available
not available
yes
yes
yes
yes
yes
flourine
yes
yes
yes
yes
yes
bromine
bromine
bromine
bromine
Yes
bromine
no
no
no
no
no
no
no
bromine
yes
yes
yes
bromine
bromine
yes
yes
yes
no
bromine
not available
not available
not available
yes
bromine
Halogen free
flourine
RO 4003 C
>280
yes
yes
yes
RO 4350
"yes"
Rogers
Shengyi
Taconic
Technolam
TUC
>280
yes
yes
yes
R/flex 1000
S 1155
S 1000
S 1170
S 1141
RF 35
TLC-32
NP 140 TL
>220
135
170
175
150-170
315
315
140
yes
yes
yes
yes
yes
yes
yes
no
yes
bromine
no
bromine
flourine
flourine
bromine
yes
yes
yes
yes
yes
yes
yes
yes
CEM3
125-130
optional
bromine
yes
Tu 662
150
yes
no
yes
Resin Type
Flame retardant/Filler
woven fiberglass reinforced
woven Glass/Teflon
Polyimide
Polyimide
FR4
FR4
Polyimide
dicy
Tetrafunctunal epoxy
phenolic
difunctional epoxy
modified epoxy
phenolic , multifunctional epoy resin
Epoxy- polyfunctional Epoxy
FR4
BT + Epoxy
BT + Epoxy
Epoxy
Polyimide + Epoxy
FR4
dicy
Tetra functional epoxy
mulitfunctional epoxy
multifunctional epoxy
dicy
dicy, phenolic
Difunctional Epoxy resin
Epoxy
FR4
Phenolic cured system
Phenolic cured (Dicy Free) system
not available
not available
not available
FR4
enhanced multifunctional resin
Polyimide
ceramic-filled PTFE
glass-reinforced hydrocarbon/ceramic
laminates
glass-reinforced hydrocarbon/ceramic
laminates
Polyimide
epoxy
epoxy
FR4
epoxy
PTFE coated woven glass fabric
PTFE coated woven glass fabric
dicy, phenolic
glas woven core and two layer of FR4 dicy
epoxy
FR4
ceramic filler
no filler
no filler
no filler
NO: halogen, antimony, or red phosphorus
No flow prepreg
no filler
no filler
inorganic filler
no filler
P, Al, Cl, Si, O
inorganic filler
Br / inorganic
All material tested or produced with standard Seleo CP Plus process parameter
Proprietary and Confidential
Br
Br / No
No filler
Br/ Ca
Br
no filler
no filler
Al2O3 filler
no filler
no filler
no filler
no filler
Al, P, Ca, Si, Mg
P/ inorganic
inorganic filler
no filler
not available
not available
not available
no filler
no filler
ceramic filler
ceramic filler
ceramic filler
Buthyral Phenolic
no filler
no filler
no
no
no
no
filler
filler
filler
filler
no filler
Customer Reference
Horizontal Lines Seleo CP Plus (1)
Customer
Country
End Market
Acid Copper
Conversion/Start Up
1
04/2008
Czech Republic
Prototyping, Industrial/Medical, Defensive
Pattern Plating,
Copper Strike
Competitor
2
07/2008
Hungary
Consumer, Communications, Computing
Pattern Plating
Seleo CP
3
04/2009
Italy
Consumer. Industrial/ Medical, IC
Packaging, Communications, Automotive
Pattern Plating
Competitor
4
04/2009
China
Communications, Automotive
Copper Strike
Seleo CP
5
05/2009
Israel
Industrial/ Medical
Pattern Plating,
Copper Strike
Seleo CP
6
05/2009
Italy
Consumer, Communications,
Industrial/Medical, Defense/Aerospace,
Computing, Automotive
Copper Strike
Competitor
7
06/2009
Germany
Industrial/ Medical
Pattern Plating
Competitor
8
10/2010
China
Communications, Computing, Consumer,
Automotive
Semi Panel
Plating
Compact CP
9
03/2011
Italy
Industrial/Medical, Automotive,
Defense/Aerospace, Communications,
Consumer, IC Packaging
Copper Strike
Compact CP
10
04/2011
Spain
Industrial/ Medical, Consumer, Automotive
Pattern Plating
Seleo CP Rebuilding
Proprietary and Confidential
Customer Reference
Horizontal Lines Seleo CP Plus (2)
Customer
Country
End Market
Acid Copper
Conversion/Start Up
11
09/2011
Italy
Communications, Computing, Consumer,
Automotive
Pattern Plating
New Line / Competitor
12
10/2011
Germany
Industrial/ Medical
Pattern Plating,
Copper Strike
New line UTS-XL /
Competitor
13
11/2011
Germany
Consumer, Communications, Computing,
Automotive, Industrial/Medical,
Defense/Aerospace
Copper Strike
Seleo CP
14
03/2012
China
Communications, Computing, Consumer,
Automotive
Semi Panel
Plating
CP Rebuilding
15
07/2012
Italy
Communications, Industrial/Medical,
Consumer
Pattern Plating
Competitor
16
09/2012
Brazil
Industrial/Medical, Automotive, Defense
Pattern Plating
New Line / Competitor
17
03/2013
China
Communications, Computing, Consumer,
Automotive
Semi Panel
Plating
Compact CP
18
03/2013
India
Automotive, Industrial/Medical
Copper Strike
Seleo CP
Atotech’s Solutions MLB Production using Advanced Basematerials
Saint Petersburg, May 2013, JPO
Proprietary and Confidential
Customer Reference
Vertical Lines Seleo CP Plus (1)
Customer
Country
End Market
Acid Copper
Conversion/Start Up
1
06/2008
Slovakia
Prototyping, Industrial/Medical
Copper Strike
New Line PPT / Competitor
2
2011
UK
Prototyping, Industrial/Medical
Copper Strike
Seleo CP
3
2012
Canada
Industrial/Medical, Consumer,
Communications
Pattern Plating
Seleo CP
4
2012
Canada
Industrial/Medical, Consumer,
Communications
Pattern Plating
Seleo CP
5
2012
Canada
Industrial/Medical, Consumer,
Communications
Pattern Plating
Seleo CP
6
02/2011
Brazil
Automotive, Consumer, Computing,
Communications
Pattern Plating
Competitor
7
04/2011
Brazil
Automotive, Communications, Computing,
Industrial/Medical, Aerospace
Pattern Plating
Competitor
8
04/2011
Brazil
Communications, Automotive,
Industrial/Medical
Pattern Plating
Competitor
9
10/2011
Brazil
Automotive, Communications, Computing
Pattern Plating
Competitor
10
11/2011
Brazil
Communications, Computing,
Industrial/Medical
Pattern Plating
Competitor
Proprietary and Confidential
Customer Reference
Vertical Lines Seleo CP Plus (2)
Customer
Country
End Market
Acid Copper
Conversion/Start Up
11
03/2012
Brazil
Communications, Computing, Industrial
Pattern Plating
Competitor
12
03/2012
Brazil
Communications, Computing, Industrial
Pattern Plating
Competitor
13
11/2012
Czech Republic
Industrial
Panel Plating
New Line PPT
14
01/2013
Brazil
Industrial, Automotive, Computing,
Consumer
Pattern Plating
New Line
Competitor
15
02/2013
Brazil
Automotive, Industrial
Pattern Plating
Competitor
16
02/2013
Brazil
Industrial, Automotive, Computing,
Consumer
Pattern Plating
Competitor
Proprietary and Confidential
OEM Reference
Proprietary and Confidential
Thank you for your attention!
For more information contact :
Jaime Peraza Ordaz
PMM Atotech Europe
Mobile: +34 606 372 364
Email: [email protected]
Cyril Champion
Product Marketing Manager Europe
PTH-PP
Mobil : +33 6 20 14 79 78
Email: [email protected]
Tobias Sponholz
Global Assistant Product Manager BTT PTH
Mobile: +49 (0)173 - 628 64 80
Email: [email protected]

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