SESAMES 2013 winner for new generation eletronic

Report
The fastest e-passport of the
world –
SESAMES 2013 winner for new
generation eletronic documents
Matthias Bruestle from MaskTech GmbH
[email protected]
Ji Zheng from Infineon Technology AG
[email protected]
Infineon Technologies – leading the
security industry for over 25 years
Infineon Chip Card & Security
CC Microcontroller IC Market Share 20131
 Infineon provides semiconductor and
system solutions, focusing on three
central needs of our modern society:
Energy Efficiency, Mobility and
Security
Infineon
24,1%
 No. 1 in the chip card security
controller market with 24%1 market
share in 2012 by revenue.
 Innovation leader with numerous
product awards:
 Sesames Award (Fastest ePassport, 2013)
Awards/Recognitions:
 Germany's Industry Innovation
Award 2010
 Nomination German Future Prize
2013
Germany´s Industry
Innovation Award
1Source:
Dec 2013
- World"
Sesames:
Best Hardware
Nomination German
Future Prize
IHS/IMS, September 30, 2013 "Smart Cards and Smart Card ICs
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 2
MaskTech
 #1 independent System on Chip / OS manufacturer for
travel & eID documents
 German company, founded in 2002
 Industries: Government ID, Health Care, Access,
Authentication, Public Transport
 Common Criteria certified embedded solutions developed in
Nuremberg, Germany
 Achievements:

Worldwide first ICAO masked OS

In over 60 countries ePassports and ID documents (10 in
Asia)

>100 million licensed
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 3
Why do we need
high speed e-passport?
 e-Passport should be the only identification document in
international traveling
 Currently only a carrier of personal identity – only inspection
 Information all around cross-border activities has to be
digitally managed and recorded
 ICAO LDS 2.0 (Logical Data Structure) to be included in
DOC9303 will specify data format and secure handling
 Complete personal data will increase
 High speed processing is mandatory in the future
to ensure quick border crossing
2013-11-18
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Page 4
4th Generation ePass
goes LDS 2.0
Logical Data Structure 2.0
 Specifies a new application independent of current LDS 1.7
to ensure backward compatibility
 Application will contain more persistent data groups for

Visas

Entry / Exit Stamps

Additional Biometric Data not considered in LDS 1.7
 To update data on the e-passport PKI authentication will be
necessary (EAC2)
 With a data capacity like a 60 page passport the complete
personal data will be up to 500 kB
2013-11-18
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Page 5
Chip requirements
 Large flexible memory on controller
Demand
 High speed contactless personalization in production
 High speed contactless readout at the border
2013-11-18
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Page 6
eID goes Multi Application
 Combine several gov’t and commercial applications on one card
 Driver: added citizen value leveraging gov’t invest
 Requirement: host many apps flexibly & secure
SDW May 2013
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 7
Major Trend of electronic ID
Security
Multiple Applications
Convenience
 Long term security
(>10 years)
 ICAO Travelling
 Performance
 Certified security
(common criteria)
 National eID
 Interoperability
 Mobile eID
 Multiple interface
 eVisa, LDS2.0 with
mega data
 Standards compliance
 System security (HW,
OS, Appl.)
Security
Performance
Memory
2013-11-18
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Page 8
3-Stages to Boost Performance
Through Contactless Innovation
1.
Higher Frame Sizes

Transmit 4 times more bytes per frame

Also available for bitrates 106-848kBit/s

Increase up to 40% application speed
2.
Very High Bitrates

Transmit data 8 times faster (6.8MBit/s)

Increase up to 40% application speed
3.
Parallel NVM Programming

Program NVM during communication

Increase up to 30% application speed
 All features are ISO/IEC compliant
 Infineon is first to introduce this features
 Features available on SLE 78 in 90nm
set date
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Page 9
Flash Controllers for e-Government
Need High Speed Contactless Data-Writing
Fast Flash Data-Writing
 Flash about to dominate government market as superior solution
 Large amounts of code and data have to be personalized
 Contactless interface dominant in many governmental apps
ISO
7816
2005
424/848
kBit/s
106kBit/s
ISO
7816
2010
ISO
7816
NOW
High Speed contactless writing can outpace
contact-based writing already today
2014-03-11
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Page 10
Acceleration Toolbox
for High Speed Perso
Modern Flash Controllers Support
 Higher frame sizes for data packages
 Programming of memory in parallel to
data transmission
 Data transmission at Very High Bit Rates
(VHBR) up to 6.8 Mbit/s
SDW May 2013
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Page 11
MTCOS ID on SLE 78 with
ISO VHBR
World‘s Fastest e-Passport Transaction Time
SAC
0.8
sec
SAC
BAC
3.1
sec
1.5
sec
MTCOS - SLE 78
with VHBR
MTCOS
SLE 78
Market
Average
2013
SLE 66
2010
2007
(1) Measurements based on certified EAC ePassports w full security implementation
(2) Measurement based on certifiable EAC ePassport w full security implementation with VHBR Very High Bit Rate data transmission
(3) Typical benchmarking hardwares lie at 2~3 seconds currently
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 12
Customer Benefit
Claims and Customer Values
 SESAMES winner 2013
 Best performance enhanced by
VHBR (Very High Bit Rate)
enables SAC ePass transition <1
second
 Increase transition efficiently by
border control up to 22%
 World-wide references (>60
countries) of secure ID solutions
from MaskTech GmbH
 Best fit for future applications
like SAC & LDS2.0
 10 years lifetime
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 13
Demonstration
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 14
Contact
Infineon Technologies AG
Am Campeon 1-12
D-85579 Neubiberg
Germany
MaskTech GmbH
Nordostpark 16
D-90411 Nuremberg
Germany
www.infineon.com
P: +49 (0) 89 234 - 0
www.masktech.com
P: +49 911 955149-0
2013-11-18
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 15

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