Latching SMA Microactuator

Report
Device Design: Stage 2
(Modified Microchannel Design)
Process Sequence
1.
2.
3.
4.
5.
Begin with four polished Si wafers
Spin SU-8 (negative photoresist) on the Si wafers and pre-bake
at 95°C
Align each of the four wafers with one of four masks and expose
the SU-8 to ultraviolet light, then post-bake at 95°C
Develop the SU8 so that the unexposed areas are removed
– Results in four distinct SU8 molds
Spin PDMS on the SU8 molds less than the vertical dimension
of the SU-8 protrusions
– Mix PDMS (Sylgard 184, Dow-Corning) 10:1 with curing
agent
– Spin on PDMS
– Dip the Si wafer in a sodium dodecyl sulfate(SDS) adhesion
barrier and allow it to dry naturally
– Bake in box furnace for 2 hours at 70°C
Device Design: Stage 2
(Modified Microchannel Design)
Silicon
SU-8 Photoresist
PDMS
STEP 1
• Start with a 4” diameter Silicon Wafer
• Spin on SU-8 photoresist (orange)
• Pre-bake at 95°C
• Align the wafer with one of the four masks
• Expose SU-8 to UV light
• Post-bake at 95°C
STEP 2
STEP 3
STEP 4
• Develop SU-8 in SU-8 developer
• Dip wafer in 0.1 M sodium dodecyl sulfate
(SDS) adhesion barrier and let dry naturally
• Mix PDMS (Sylgard 184, Dow-Corning) 10:1
with curing agent.
• Spin on PDMS (purple).
• Bake in box furnace for 2 h at 70°C.
STEP 5

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