PLED-OLED원가비교

Report
TDS(Technical Data Sheet)
KP-2100
Mar. 2007
KOLON Electronic Materials B.C.
KS-8700 Series
GENERAL FEATURES
Scum Free
Excellent Plating Chemical Tolerance
Excellent Alkaline Etching Resistance
APPLICATION
Plating Process
Selective Gold Plating
Alkaline Etching
FILM SPECIFICATION
Thickness : 40, 50 mm
Color (Unexposed) : Green
Color (Exposed) : Blue
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General Properties [Circuit Properties]
KP-2140
KP-2150
Dry film Thickness (mm)
38
48
Minimum Develop Time (sec.)
26
34
Step
Exposure
Property
Exposure Energy *1
(mJ/cm2)
Resolution
(mm)
Circuit *2
Properties
Adhesion
(mm)
L/S=1/1 Resolution
(mm)
21sst
41sst
6
16
17
19
7
19
24
27
8
22
34
40
9
25
52
60
6
16
29
32
7
19
31
35
8
22
38
42
9
25
46
50
6
16
43
57
7
19
35
48
8
22
27
40
9
25
25
31
6
16
37
53
7
19
33
44
8
22
39
40
9
25
48
50
*1: Exposure Energy ; Real Exposure energy (ORC UV meter),
*2: Circuit properties : Perkin-Elmer 5Kw Collimated Exposure, KOLON TEST Artwork ( Glass Artwork)
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General Properties [Strip Properties]
Step
Strip
Properties
Stripping Time
(sec)
3.0 wt% NaOH
41sst
6
16
37
45
7
19
46
65
8
22
53
78
9
25
63
93
0.63
0.71
2.7
2.6
Scum free
Scum free
Instron
Elongation(mm)
Scum
KP-2150
21sst
Strength(kg)
Tenting
KP-2140
Scum Generator
Skin Size - S : Small, M : Medium, L : Large
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Sensitivity vs. Exposure Energy
100
KP-2140
KP-2150
90
Stouffer 41 Step Tablet
80
70
60
60
50
40
52
40
27
30
34
19
20
24
17
10
0
15
16
17
18
19
20
21
22
23
24
25
26
Step Held (41 SST)
Test condition
•Stouffer 21 and 41 Step Tablet, Resist step
• Exposure System : Perkin-Elmer 5kw Collimated Exposure
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Resolution
60
KP-2140
KP-2150
50
50
Resolution ( mm)
42
40
46
35
32
38
30
31
29
20
10
0
15
16
17
18
19
20
21
Step Held (41 SST)
22
23
24
25
26
Test Condition
•Stouffer 21 and 41 Step Tablet, Resist step
•Test Artwork : KOLON Test Artwork(Glass Artwork)
•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min
•Develop. condition : 1.0wt% Na2CO3, Temp. 30℃,Break Point 50%, Spray pressure 1.5kg/cm2
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Adhesion (Minimum Survived Line Width)
60
57
KP-2140
KP-2150
48
50
Adhesion ( mm)
40
40
43
31
35
30
27
20
25
10
0
15
16
17
18
19
20
21
Step Held (41 SST)
22
23
24
25
26
Test Condition
•Stouffer 21 and 41 Step Tablet, Resist step
•Test Artwork : KOLON Test Artwork(Glass Artwork)
•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min
•Develop. condition : 1.0wt% Na2CO3, Temp. 30℃,Break Point 50%, Spray pressure 1.5kg/cm2
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1/1 Resolution
60
1/1 Resolution ( mm)
50
48
53
37
40
50
39
44
33
40
30
20
10
KP-2140
KP-2150
0
15
16
17
18
19
20
21
Step Held (41 SST)
22
23
24
25
26
Test Condition
•Stouffer 21 and 41 Step Tablet, Resist step
•Test Artwork : KOLON Test Artwork(Glass Artwork)
•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min
•Develop. condition : 1.0wt% Na2CO3, Temp. 30℃,Break Point 50%, Spray pressure 1.5kg/cm2
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8
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Strip Properties
80
KP-2140 3wt%
KP-2150 3wt%
70
Stripping Time(sec.)
60
50
40
30
20
10
0
15
16
17
18
19
20
21
Step Held (41 SST)
22
23
24
25
26
Test Condition
• Pretreatment ->Lamination->Exposure->Develop->Etching -> Strip
•Temperature : 50 C, Conc. : NaOH 3, 4 wt%
•TEST Method : Dipping Method
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Tenting: INSTRON Method
Stress/Strain
P robe
X = 3Ø
Y = 6Ø
Stress : Load of Max load when the 6mm hole broken.
Average of 8 times test.
D r y f i l m Ph o t o r e si st
Strain : Displacement during the hole broken
at Max.load(mm)
Average of 8 times test.
x
X = 3Ø
Y = 6Ø
C oppe r B oa rd
3.0
y
INSTRON
2.5
KP-2140
KP-2150
2.0
KP-2140
KP-2150
1.5
Step Held
(21 SST and 41 SST)
8/21 ; 22/41
8/21 ; 22/41
1.0
Strength(kg)
0.63
0.71
Elongation(mm)
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2.7
0.5
0.0
2.6
Strength(Kg)
Elongation(mm)
Tenting
10
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SEM Images of KP-2140(X200, X350)
Line / Space = 50 / 50 mm
19 / 41SST(7 / 21SST)
22 / 41SST(8 / 21SST)
25 / 41SST(9 / 21SST)
200 Times
350 Times
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SEM Images of KP-2150(X250, X400)
Line / Space = 50 / 50 mm
19 / 41SST(7 / 21SST)
22 / 41SST(8 / 21SST)
25 / 41SST(9 / 21SST)
250 Times
400 Times
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Evaluation Parameters (Sensitivity)
Step Tablet Relationships
Step Held
Optical
Density
Kolon
Step
(21)
Exposure
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2
3
4
5
6
7
8
9
10
11
12
13
14
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
Kolon
Step
(21)
Development
2
3
4
5
6
7
8
9
10
11
12
13
14
13
DuPont
25 Step Tab.
Stouffer
21 Step Tab.
Stouffer
31 Step Tab.
Stouffer
41 Step Tab.
1
1
2
2
3
4
3
5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
4
6
7
5
8
6
9
10
7
11
8
12
13
9
14
10
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
[Execution defines Value]
General Process Guideline
Process
Recomendation
Specification
Roll Temp. (°C)
110 ± 10
Speed (m/min)
2.0 ± 1.0
Roll Pressure (Kgf/cm2)
3.5 ± 1.5
Holding Time
Time (min)
15min – 8hrs
Under Yellow Light
Exposure
Exposure Energy (mJ/cm2)
Step Held
7~10/21ST
Without Artwork
Resist Step
Holding Time
Time (min)
15min – 8hrs
Under Yellow Light
Chemical
1.0 ± 0.2wt% Na2CO3
Temp. (°C)
30 ± 2
Break Point
50~70%
Spray Pressure (Kgf/cm2)
2.0 ± 0.5
Chemical
2 - 4wt% NaOH
Temp. (°C)
45-55
Break Point
40~60%
Lamination
Development
Stripping
Exit Temp.: 50  10 °C
*Antifoam:
Non-silicon Type
(0.05 ~ 0.1 vol%)
* Clean Room: 20~22 °C, 50 ± 10 % RH
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