Presentation

Report
Power & Hybrid Business Unit,
Microelectronics
©2012 TT electronics plc
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Who Are we?
Manufacturers of ultra reliable, high performance discrete
semiconductors, power modules & hybrid microelectronic
solutions designed to operate in any environment.
©2012 TT electronics plc
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Our aim
Through our flexibility and innovation, we aim to be
recognised as trusted technology leaders in the aerospace,
space, defence, medical and industrial markets.
©2012 TT electronics plc
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What we do
We research, design and manufacture an innovative range of
MOSFETS, Bipolar Transistors, IGBTS, Power Modules, Diodes,
Voltage Regulators and Customised Hybrid Microcircuits.
©2012 TT electronics plc
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Customers and markets we serve
Aerospace Market Segments

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Actuation
RADAR
Engine control
Flight subsystems
. Space Market segments

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Commercial Satellite - Telecoms, Broadcast,
GPS, Weather
Exploratory Missions
Nano and Cube Satellites
• Military Market segments
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Transportation
Communications
Homeland Defence
Aircraft
UAVs
• Motorsport Market segments

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Formula 1 KERS
Touring Car KERS
Industrial Market segments
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RF
Energy (oil/gas, renewable)
Audio
Power conversion & management
• Medical Market segments

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Analytical equipment
Oncology equipment
De Fib
©2012 TT electronics plc
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Our Portfolio
Product/
Technology
Features
Applications
Benefits
Discrete Semiconductors
•
Wide Range of modern &
traditional packages
Screening to International
standards
•
•
•
Down-hole drilling
Satellites
Defence programs
•
High Gain
Excellent linearity
•
•
•
Jammers
Radios
Broadcast
•
IGBT’s, MOSFET’s,
Diodes
High-Rel screening
Hermetic or Plastic Hi-Rel
•
•
•
Aircraft Actuation
Power Factor Correction
Hybrid Motor Drive
•
•
•
Extended reliability
Long term supply
Harsh environment
capability
Superior resistor
characteristics
MIL-PRF-38534, Class H
certified & MIL-STD-883
screening options
Fully customized circuits
High temperature
5
operation
•
Aero-engine cooling
systems
Renewable energy – Solar
CPV
Driveline modules
Exhaust after treatment
•
•
Reduced size
Improved circuit
performance
Enhanced thermal
properties
Improved reliability
•
RF (VDMOS) MOSFETs
Power Modules
•
•
•
•
•
Hybrid Microcircuits
•
•
•
•
•
•
•
•
•
•
•
•
Choice of silicon to match
application
35 year pedigree of
supply
Never made a part
obsolete
Higher performance
Very rugged and reliable
©2012 TT electronics plc
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Power Modules
•Power conversion: Inverters for
wind & solar
•Motor drive: HEV (on and off road),
traction
•Actuation: Hydraulic replacement,
steering
High Temp
•Motor drive actuation
•Control systems
•Inverters
•Power factor correction
Space
Discrete product for Satellite
subsystems:
•Nano and Cube satellites
•GPS and Communications
constellations
•Weather/Scientific monitoring in Space
Solar
• Concentrated Solar energy
collection systems - using photovoltaic cells
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Customer Requirement
•
Automotive KERS Module
Power module solution for racing car Kinetic Energy Recovery System (KERS)
Solution
•
Custom Power Module
• Custom configuration for application
• Enhanced electrical, temperature and mechanical operation
Value Proposition
•
•
•
High temperature capability through using latest available technologies
Customised solution utilising the latest aerospace technologies to deliver high reliability
in a very harsh environment
Reduced weight through utilising latest materials to deliver a solution that is light yet extremely
rugged
Core Competence
•
•
•
Flexibility – Closely working with the customer to realise their stringent technical & environmental
requirements
Innovation – Utilising cutting edge mechanical and silicon/SiC technologies to achieve the spec
Pedigree - 35 years proven understanding of harsh environment requirements for high temperature and
high reliability applications
Status
•
•
•
•
Successfully designed, built and winning races
Currently working with teams on the 2013 season
Proven experience and success at the highest performance level
Now looking to move into more race types
Reason for success?
• Technical Innovation, experience in ultimate reliability and close engineering to engineering relationship
with customer to understand their application and deliver a winning solution
©2012 TT electronics plc
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Why Use Microelectronics
Braking Resistors/Heaters
Power & Control
High Power
High Density & Reliability
High Frequency
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Thick Film Circuit
Thick Film Ink Systems

Printing – Firing – Lasering

Gold, Silver, High and low Temperature Copper.

Resistor Printing directly in circuit.

Aspect ratio to 0.1mm track and gap width, +/0.03mm registration.

Automatic printing machines cassette to cassette
process.

Automatic Laser trimming and continuity testing.

Clean-room facility operating on 3 shifts.
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Technologies
Substrates

Thick film on 96% alumina or aluminium nitride

Directly bonded copper (DBC)

Active metal braise on aluminium nitride & silicon
nitride

High/Low temperature co-fired ceramic (HTCC/LTCC)

Steel

Aluminium

Thin film

FR4
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Technologies
 Component Attach
– Solder Surface Mount
– Polymer Component and die attach
– Vacuum soldering (Power Die Attach) up to
400oC
 Wire Bonding
– Fine wire Au 17um to 33um
– Fine wire Al 25um to 33um
– Large diameter Al >125um
 Packaging
–
–
–
–
Hermetic sealing
Projection weld & Seam Seal
Ceramic lidding
Glob-top / Silicon conformal coat
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Microelectronics Assembly

Clean-room assembly operations.

Automated die bonding and wire bonding by
pattern recognition.

Re-flow soldering and real time x-ray for void
detection.

Aluminium fine wire bonding for high density
signal and control circuits.

Large diameter Aluminium wire bonding for
power circuits.

Hermetic sealing in inert atmosphere.

Leak detection.

Automatic test facilities.
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Test, Burn-In and Screening Facilities
Test

Two General Purpose ATEs in Chip & Wire Clean Room.

One reduced capability, DC only, ATE.

One General Purpose ATE for one high volume product.

Two ATEs for surface mount hybrids.

One tray pack system – measure, accept/reject, pack.

One PIC program/test XYZ system.
Screening:

Temperature cycling

Constant acceleration

Burn-in

Fine & Gross Leak Test

Pin D

Bump

Limited range vibration
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MCM Engine Management
Function:
Characteristics:

Engine management (FADEC)

High Temperature Co-fired Ceramic (HTCC)

Custom ASIC - CPU, SRAM, EPROM, Oscillator

Chip and Wire (>1000 bonds)

Hi Reliability >20yrs life

High Density – Reduced size and Weight

Hermetically sealed

Engine mounted

Qualified –55oC to +150oC

Extended high temperature approval testing –
55oC to +205 oC.

Completed 1000 hours +205oC

Completed 100 cycles –55oC to 205 oC
©2012 TT electronics plc
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MCM (Linear) Engine Management – Civil Aviation
Function





3 Precision instrumentation amplifiers
High common mode rejection
Precision gain
3 Precision voltage references
General purpose comparator
Characteristics

High operating temperature -55oC to +150oC

Engine mounted

Thin Film provides high accuracy and stability.

Active Trimming to <0.01% tolerance.

High precision and accuracy achieved with low
cost Commercial Off The Shelf Components.
Easily redesigned if amplifiers or reference
become obsolete

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DC/DC Converter – Civil Aviation
Function:





3 Fixed DC Outputs from 14 to 36VDC
28 Watts
Flight computer System
Self Monitoring
Self Diagnostics
Characteristics:


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Mixed power and control circuits.
High reliability >20 years life proven through
extreme temperature cycling (>3,000 cycles)
and HALT testing.
Operating temperature -40oC to +95oC
High packing density.
Relatively low cost.
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Safety Critical Fuse
Function:

10 amps continuous current carrying capacity

Fuse activation by external control

Fusing time <5 second @ -40oC to +110oC
Current applications:

Wing ice protections system, heater circuit
protection (787 Dreamliner)

Engine de-icing (Joint Strike Fighter) heater
protection
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Power MCM – Civil Aviation
Function:

Part of Wing Ice Protection System

Switching controls power to wing tip or engine
heaters (up to 5 amps continuous without
heatsinking).

Used in conjunction with thick film solder fuse
protection device
Characteristics:
 Each module contains 8 MOSFETs with low Rdson
(<138m Ohm)
 High packing density and low assembly cost
(35mm x 20mm)
 Good thermal management
 High reliability
©2012 TT electronics plc
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Sonar Transducer Power Driver – Naval Systems
Function:

H Bridge MOSFET Switch to control power to
sonar antenna

Intelligent switch with ASIC control and MOSFET
drivers.
Characteristics:
 Each module contains 4 MOSFETs with low Rdson,
drivers and control ASIC
 Uses mixed technologies
 Good thermal management
 High reliability
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Flight Controls

Steel Dynamic Braking Resistors

For Aileron, Elevator and Rudder Actuation

Increased power dissipation by the use of bottom
and top heat sinking

Low profile, Low Weight

Design-ins on:
– Airbus A400M
– A330 MRTT
– Boeing 787 EBACS
©2012 TT electronics plc
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Power Resistor – Motor Speed Control

Design for high temperature environment

Design for high reliability

Low Profile, fits in motor housing

0.7 Ohm Resistance

Curved shape to fit in housing
Test Requirement
Duty Cycle
Power
On
Off
Number
Cycles
300W
3
10
100
100W
10
10
50,000
©2012 TT electronics plc
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AIN Heater – Toner Fusing
Function:

Instantaneous heating with individual control of 3 discrete segments

210°C in 2 seconds (1kW)

Precision Temperature Control
Characteristics:

Large size printing

AlN
 Hi thermal Conductivity
 Resistance to thermal shock

Developed Inks with Fraunhofer Institute
©2012 TT electronics plc
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Hi Frequency Telecoms
Function:
Frequencies up to 38GHz
Hi Reliability
Direct feed to antenna
Small Package size
Characteristics:

Low loss at high frequency

Gold based ink

0.38mm thick substrate down to 0.1% tolerance

Good thermal management

Precise track definition
©2012 TT electronics plc
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Automotive – Mass Air Flow Sensor
©2012 TT electronics plc
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Industrial – Ink Jet Print Head
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Military and Avionics
©2012 TT electronics plc
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Industrial – Power Module
©2012 TT electronics plc
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