The Digital and the RF World are MERGING

Report
Convergence of
RF & Digital
Technologies
Presented by:
Mohit Khanna
R&D Operating Manager
Agilent Technologies
Working with Digital and RF can be as easy as ABC
Group/Presentation Title
Page 1
Month ##, 200X
Convergence of RF & Digital Technologies
Abstract:
With the rapid development of mixed signal technology to fulfill ever growing need to make
newer electronics gadgets smarter, smaller & cheaper throws out a unique challenges for
designers as these technologies pose interesting and often contradictory challenges.
As a recognized market & innovation leader in RF & Mixed Signal Simulation space alongwith
state-of-the-art T&M, Agilent Technologies provides competitive & technological edge to
designers/developers working in ever challenging environment to be successful. During the
course of presentation we shall provide insights on latest design & development challenges with
tools & techniques to be successful.
Presenter’s Profile
Mohit is B.Tech in Electronics and Telecommunication from
Allahabad University and M.Tech from IT- BHU in RF.
Previous to working in Agilent, Mohit worked with ISRO as
Scientist for six years. For last 6 years, Mohit is working with
Agilent Technologies. Currently Mohit is working as Operating
Manager looking into Software Testing & Quality Assurance
of Agilent EEsof software products.
He can be reached at [email protected]
What’s the Story?
The Digital and the RF World are MERGING
It’s a REALITY: A standalone working Baseband and a standalone
working RF front-end does not GAURANTEE a working system!
Baseband Designer
Digital
4
RF Designer
RF
Challenges for System Designer
“Cross the A/D Converter Divide”
(1) Requires both Digital and RF Knowledge to understand the complete
“picture”
(2) Needs a tool to perform
Baseband/RF co-simulation.
Design paths has to remain in
contact throughout the design
process. Continuous crossverification allows aggressive
RF/Baseband partitioning,
and reduced design
margins with lower project
risk.
5
RF
Digital
Fear Factor
“Crossing the A/D Convertor Divide”
 System engineer
who are RF trained
need to learn the
digital way
 System engineer
who are Digital
trained need to
understand the RF
world
6
RF Digital
How do we ensure integration goes smoothly?
Baseband and RF Cross verification is a MUST!
Digital
RF
Communication Link where Agilent tools have role
to play
PHY Architecture
Research
Analysis
Partitioning
Verification
Instrument Links
Baseband DSP
Modeling Algorithms
Code-Generation
Fixed Point/HDL
Verification
MIMO/Channel
Fading
Jamming
Noise
Interference
Arrays/Steering
RF System
Architecture
Behavioral/Noise
X-parameters
Links from ADS/GG
PHY Reference IP
Wireless Standards
Interoperability
Virtual H/W
Coded Test Vectors
EDA/Test integration
Overcoming System Design Challenges
 Using a Mixed Signal System Design tool which allows Digital/DSP as well as RF
system modeling allows designers to partition their designs more accurately
 This analysis also allows to mitigate the initial RF + Digital/DSP integration
challenges and performance optimization
More mixed technology (RF, analog, digital)
boards
Globally dispersed, isolated design team
specialists
RF
Digital
Digital
Synthesizer
More complex multilayer, multifunctional RFhigh speed mixed signal boards
RF
Filters
Mixed Signal PCB Challenges:
Higher integration, higher complexity, smaller size
RF
Continued pressure to meet an electronic
company’s business needs:
RF Converter
• Shorter design cycle times
• Reduced development and end product costs
• More competitive
products
• Lower price points
Digital
Controller
Analog
RF
Osc
Agilent Spectrum Analyzer Mixed Technology RF PCB
Advanced Mobile Wireless IC Trends
BB
2010
Next
Core
ARM9
ARM11, QMSM
Clock
300MHz
600MHz
RAM
PoP
TSV
Process
65/45/40nm
28nm LHP
uP
2010
Next
CPU
Single
Multiple
GPU
Tens
Hundreds
Clock
> 1GHz
> 2 GHz
RAM
PoP
PoP/TSV
Process
45/40nm
28nm LHP
Cellular Base Band
Apps
Processor
Cellular Radio/FEM
2010
Next
GPS
RF Switch
PA
Integration
Module
Si Carrier/3DIC
Process
GaAs
GaAs + CMOS
WiFi+BT
Bands
7
>10
Wireless
Connectivity
Integration
Radio
Passives
2010
Next
2010
Next
2010
Next
WiFi+BT+FM
+GPS+NFC
Type
Discrete
Integrated
Mode
Single
Dual
Process
65/40nm
28nm
Process
SMT
IPD/Interposer
Process
65/40nm
28nm
802.11ad/15.3c
Radio-90/65nm
Radio + BB
65/40/32nm
Group/Presentation Title
Higher Levels of Integration, More “Radios”, Advanced Technology
Page 11
Month ##, 200X
Growth for RFIC Segment
Wireless Design Complexity
Radio design challenges associated with increased complexity:
• Trend is complex signaling which requires a more complete verification flow:
• Analysis of full RX/TX functional path with “real” signals
• System Design and Circuit Realization May Be Misaligned
• Cost is a Verification Bottleneck
• Trend is for More Bands and Higher Frequencies:
• Broadband Millimeter Wave ICs are Being Designed in CMOS!
• Trend is toward most advanced process technologies for RF
• RF Design Enablement is essential for success
• New yield effects require additional verification before tapeout
• Advanced technologies are driving new packaging alternatives
LTE TX Signal
LTE RX Band
Upconverted
Interferer
12
How Agilent can help?
Agilent EEsof Software Solutions….
Device
Modeling
SystemVue
GoldenGate
ADS
EMPro
Genesys
IC-CAP
RFIC
MMIC
RF SiP /
Hybrid
RF
Board
Signal
Integrity
Comms
ESL
Perform Early Verification using Combination of
H/W and S/W
LTE FDD UL Throughput Test (TS 36.141), or BER/BLER
STEP 1
Signal Generator
SystemVue – Generates signal, then closes the loop
Customer Hardware eNodeB receiver
Filter
X
~
A/D
Filter
~
X
A/D
RU
Filter
1
2
3 4
C
P
R
I
DU
DU
DPD Gain
STEP 2
SystemVue – LTE decode
VSA 89600 waveform recording
Signal Analyzer
SystemVue closed a loop to
help measure LTE throughput
APP NOTE 5990-6202EN
Page 14
Resources:
1.
2.
3.
Agilent Website: www.agilent.com
Agilent EEsof: www.eesof.com
Agilent EEsof Channel on You Tube: www.youtube.com/user/AgilentEEsof
Thank You
Q&A Session

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